Area, Design Complexity and Solution Cost
Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, today announced availability of the LX5551 and LX5552 front-end modules (FEMs) for IEEE 802.11b/g/n applications in the 2.4-2.5GHz frequency range.
"Microsemi's new LX5551 and LX5552 FEMs significantly reduce the PCB area for a typical WLAN design," said Kang Hee Kim, RF product line manager at Microsemi's Analog Mixed Signal Group. "This area savings, combined with integrated on-chip input and output matching circuitry, reduces RF design complexities while at the same time reducing the bill of material cost for portable device designers faced with challenging size constraints."
Addressing small form factor requirements driven by portable devices featuring WiFi connectivity, both modules are offered in a low-profile 3x3mm 16-pin MLPQ package. Each also features an integrated power amplifier, 50 ohm input and output matching, and single-pole-double-throw (SPDT) switch. The LX5551 cuts board space by more than 30 percent as compared to a discrete design. Additionally, the LX5552 integrates a low noise amplifier (LNA) for improved system performance while saving nearly 50 percent of the board area required for alternative discrete implementations.
Both devices ease RF design complexity by integrating multiple active components and external tuning passives, resulting in significant PCB area savings, and minimized solution cost.
LX5551 KEY FEATURES
- 2.4-2.5 GHz operation
- 50 ohm input and output matching
- PA power out 18dBm at antenna for 3 percent error vector magnitude
- PA 27dB orthogonal frequency division multiplexing (OFDM) power
- PA temperature compensated output power detector with wide dynamic
- SPDT switch with low insertion loss and excellent isolation
- Low profile (0.9x3x3mm) 16 pin RoHS-compliant micro leadframe quad
(MLPQ) package
LX 5552 KEY FEATURES
- 2.4-2.5 GHz operation
- 50 ohm input and output matching
- LNA noise figure of 2dB including SPDT switch loss
- PA power out 17dBm at antenna for 3 percent EVM
- PA 27dB OFDM power gain
- PA temperature compensated output power detector with wide dynamic
- SPDT switch with 0.6dB insertion loss and excellent isolation
- Low profile (0.55x3x3mm) 16 pin RoHS-compliant MLPQ package
Microsemi's portfolio of WLAN, WiMAX and WiBro power amplifiers is used in a variety of applications including wireless access points and half mini-cards for notebooks and netbooks. Reference designs with market-leading WLAN chipset manufacturers are available for many Microsemi power amplifiers.
Pricing and Availability
The LX5551 is in production and priced at $0.99 in 10,000-unit quantities. The LX5552 is sampling and priced at $1.39 in 10,000-unit quantities. Data sheets are available on the Microsemi website: http://www.microsemi.com. Application notes and evaluation kit information are available from local Microsemi sales representatives: http://www.microsemi.com/contact/contactfind.asp.
Attachments:
Figure 1: Microsemi LX5551/52 Image
http://www.microsemi.com/PRImages/LX5551_52_Photo.jpg
Figure 2: Microsemi LX5551 Block Diagram
http://www.microsemi.com/PRImages/LX5551_Block_Diagram.pdf
Figure 3: Microsemi LX5552 Block Diagram
http://www.microsemi.com/PRImages/LX5552_Block_Diagram.pdf
About Microsemi
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.
Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.
The Microsemi Corporation logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=1233
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